Samsung Galaxy S III gets the iFixit tear down treatment, reveals iPhone 4S camera module inside

The guys at iFixit have given Samsung’s Galaxy S III its customary tear down treatment. The tear down reveals more insight in relation to the internal components of the device. The tear down reveals the supercar like Exynos quad-core processor clocked at 1.4GHz, which has been built on PoP assembly like the Apple A5 chip that is also manufactured by Samsung.
Other internals revealed by the tear down include a multi-chip memory module made by Samsung, a Intel Wireless Baseband (same as the Galaxy S II), a Melfas touch screen controller, a Wolfson Audio codecs, a Maxim power management IC, a Audience voice processor, a Sillicon Image RF Transmitter, a STMicroelectronics AMOLED Display driver, a Broadcomm chip for numerous Wi-Fi standards along with another chip for GPS also made by Broadcomm.
There is also NXP NFC chip and a Skyworks power amplifier.For the camera, Samsung uses a Sony 8-MP BSI sensor, which happens to be the same as the one in the iPhone 4S! Mere coincidence? We doubt. Nevertheless, head over to iFixit if you are fond of checking out the Galaxy S III’s guts.